Epoxy Resin

EpiFine Epoxy Adhesive

Finepolymers, a 100% owned by KISCO, is specializing in epoxy adhesive.
Finepolymers have Epoxy Modified division, and Semiconductor's Etching Residue Remover Division.
Epoxy Modified Division treats various resins that can be classified in to two:-

Component type resin, which is used for the sealing of electric relay. Resin used for the sealing of electric relay has many advantages, such as high viscosity, low out-gas essence, low temperature cure and storable at room temperature. Many Electric Relay manufacturers are using this resin.
Components type resin, which is used for sealing LED – mainly bullet type - has been widely used by manufacturers in Japan, Taiwan and Korea

Physical Properties of EpiFine epoxy resin..

Superior adhesive strength to various engineering plastics (PBT,LCP)
Keep strength even at high temperature. (250 degree Celsius)
Lower mis-curing by separation of epoxy and hardener
Lowering outgas that has bad effects on contacts.
Superior electric properties, especially superior tracking resistance property (C.T.I.)

Epoxy Resin (EpiFine)

In the field of power hybrid ICs, progress is being made every day in terms of miniaturization, higher degree of integration and higher power. These substrates require a higher degree of heat dissipation as well as higher reliability and processing power than their predecessors.

Features

Excellent adheisive strength

Good heat and chemical resistance
Good adhesive strength with engineering plastics (PBT, LCD etc.)

Preservation stability

transporation and stock at room temperature, which lead to cost down

Low outgas

No organic gas generated during reaction

Freindly handling

Controlled epoxy flow characters
low toxic for humans (reduce the risk of skin rash)

Electronic property

Over 560V for C.T.I value (IEC112)

Epoxy Resin (EpiFine)

In the field of power hybrid ICs, progress is being made every day in terms of miniaturization, higher degree of integration and higher power. These substrates require a higher degree of heat dissipation as well as higher reliability and processing power than their predecessors.